🎓 JobsStudent.com

Your Gateway to Student Success

← Back to Student Jobs

Photonic Process Engineer: Wire Bonding & Die Attach

Student-Friendly Entry-Level
Company

Ciena Corporation

Location

ahuntsic north, Canada

Posted

June 06, 2026

🎓 Ready to Start?

Join thousands of students launching their careers

Apply Now

About This Opportunity

A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.
#J-18808-Ljbffr