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Semiconductor Packaging Engineer

Student-Friendly Entry-Level
Company

Global Connect Technologies

Location

guadalajara, Mexico

Posted

June 12, 2026

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About This Opportunity

  • 8+ years of experience in flip-chip-BGA package design with high-speed SerDes (BSEE or similar field) or 6+ years of experience with MSEE or similar field.
  • Experience with Cadence APD (Allegro Package Designer) or equivalent tools.
  • Knowledge of package-level signal integrity and power integrity.
  • Self-management and organizational skills.